Copper Sputtering Target Element Symbol : Cu Purity : > 99.99% Available Shape : Planar ,Rotary ,Arc
Copper Sputtering Target
Manufacturing Process : Vacuum Melting Technology
Chemical formula : Cu
Melting Point : 1084.62℃
Density:8.96 g.cm3
Specification : Max 4000mm x 300mm ; Or as customers' requirements .
Purity : 99.99% ~99.999%
Application :
Due to its high electrical conductivity, copper is becoming increasingly popular for use in large-format, high-resolution TFT-LCD television sets. Copper is used as the electrode layer in thin-film transistors. The copper layer controls the individual image dots ( pixels) and therefore determine the quality of the obtained image .
Please send us your request with below details to " sales@mdlmaterials.com"
1. Size /Tolerance ( or drawing )
2. Purity
3. Quantity