Material :Bi2Sr2Ca2Cu3O10 Purity : 99.99% Size :As requested Bonding is suggested Check with us " sales@mdlmaterials.com " with below details for quotation
Product Name:
Bi2Sr2Ca2Cu3O10 BSCCO Sputtering Target
Product Description:
Enhance your sputtering applications with our top-notch Bi2Sr2Ca2Cu3O10 BSCCO Sputtering Target. Crafted from bismuth strontium calcium copper oxide, it guarantees accurate and effective thin film deposition. Elevate your materials science research effortlessly!
Product Features:
- High-quality Bi2Sr2Ca2Cu3O10 BSCCO material
- Guaranteed accuracy and effectiveness in thin film deposition
- Ideal for sputtering applications
- Elevates materials science research
Applicable Groups:
- Materials science researchers
- Sputtering applications engineers
- Thin film deposition experts
- Scientists in the field of superconductivity
Applicable Scenarios:
- Research labs
- Universities
- Semiconductor manufacturing facilities
- Thin film deposition facilities
Cost Performance:
Our Bi2Sr2Ca2Cu3O10 BSCCO Sputtering Target offers excellent cost performance, providing high-quality results at a competitive price. Invest in this reliable product to elevate your research and development efforts without breaking the bank.
Don't miss out on the opportunity to enhance your sputtering applications with our top-notch Bi2Sr2Ca2Cu3O10 BSCCO Sputtering Target. Elevate your materials science research effortlessly and achieve accurate and effective thin film deposition. Order yours today!
About Target : The ceramic compound targets are brittle and have poor thermal conductivity . With long time sputtering may cause the target fragmentation . After bonded with copper backing plate ,the thermal conductivity of the compound target can be imporoved ,the working time of the target can be increased . And the target with bonding can be still used even it cracked during sputtering . We highly recommend the compound target to be bonded when ordering .
About Bonding :
Bonding material : Indium or Elastomer
Bonding thickness : 0.1mm around for the bonding thickness
Bonding backing plate :OFHC copper ,Molybdenum and Stainless steel
Notice : Indium melting point is around 156 degree ,it may melted if the working temperature is over the melting point .
Advantage of bonding :
1.Good protection of the fragile targets when transportation .
2.Bonding can fix the problem of target sizes limitation .
3. Making the target has better cooling when sputtering ,which can avoid the uneven sputtering and target cracking when sputtering .
4. Making the targets has better thermal conductivity with bonding .
About working :
The ceramic compound target & sintering alloy target are fraigle ,they may break when high powder sputtering ,suggestive sputtering power is not over 3W/cm2
Check with us " sales@mdlmaterials.com " with below details for more details .
