EN | CN
Home ProductsNewsContact Us
Home / Products / Wafer and Substrates / Silicon Wafer

Silicon Wafer Cutting

We can provide high temperature superconducting thin film substrate , magnetic thin films and ferroelectric thin film substrate , semiconductor crystal , optical crystal , laser crystal materials ,at the same time provide orientation and foreign universities and research institutes to provide high quality ( ultra smooth ,ultra smooth , ultra clean)

Maideli Wafer : Silicon Wafer Cutting

Silicon Wafer Cutting

Production MethodCZ
Length x Width10mm x 10mm ; 5mm x 5mm ; 15mm x15mm ;etc...
Thickness100um ,200um ,300 um ,400 um ,500 um ,600 um , 700um ,800 um ,900um ,1000um 
TypeN type / P type
Orientation<111> , <100>,<110>
Resistivity 0.002~25000 Ω.cm
Flatness TIR<3um

Warping degree TTV

<10um

flexibility BOW

<10um
Roughness <0.5nm
Granularity<10 ( for size >0.3um)
Application

Used for synchrotron radiation sample carrier, PVD/CVD coating as substrate, magnetron sputtering growth sample, XRD, SEM,Atomic force, infrared spectroscopy, fluorescence spectroscopy and other analysis test substrates, molecular beam epitaxial growth substrates, X-ray analysis of crystalline semiconductors


Please send us your request with below details to " sales@mdlmaterials.com" 

1. Size with tolerance  (Length/Width/ Thickness  )

2. Type ( N or P type )

3. Orientation 

4. Electrical resistivity

5. Polishing Side (SSP or DSP )

6. Quantity


Product Name: Silicon Wafer Cutting

Contact Us
  • Tell.: +86 510 8160 3363
  • Fax.: +86 510 8160 3363
  • Skype: adaxier
  • E-mail: sales@mdlmaterials.com
  • Add.: No.6 Xinyuan Road, Jiangyin City, Jiangsu Province, China, 214400.